A cooling system using two-phase closed thermosyphon for telecommunication MCM: Experiment and simulation.

Description
Title: A cooling system using two-phase closed thermosyphon for telecommunication MCM: Experiment and simulation.
Authors: Rhi, Seok-Ho.
Date: 1996
Abstract: The present study is concerned with a cooling system for multichip modules (MCM) in telecommunication systems. Due to the higher device operation speed and higher packaging density, the resulting heat flux is known to be 1 to 2 W/cm$\sp2$, which is one or two orders of magnitude higher than those of conventional systems, and beyond the capacity of high performance air cooling systems. A cooling system which can deal with a high heat flux of up to 4 W/cm$\sp2$ is the one that employs two-phase closed thermosyphons, (i.e., wickless heat pipes) and the present study presents the results of experimental and simulation study on a cooling system using two-phase closed thermosynphons for the cooling of MCM.
URL: http://hdl.handle.net/10393/9855
http://dx.doi.org/10.20381/ruor-7997
CollectionTh├Ęses, 1910 - 2010 // Theses, 1910 - 2010
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