A cooling system using two-phase closed thermosyphon for telecommunication MCM: Experiment and simulation.

dc.contributor.advisor	Lee, Y.,
dc.contributor.author	Rhi, Seok-Ho.
dc.date.accessioned	2009-03-25T19:58:10Z
dc.date.available	2009-03-25T19:58:10Z
dc.date.created	1996
dc.date.issued	1996
dc.degree.level	Masters
dc.degree.name	M.A.Sc.
dc.description.abstract	The present study is concerned with a cooling system for multichip modules (MCM) in telecommunication systems. Due to the higher device operation speed and higher packaging density, the resulting heat flux is known to be 1 to 2 W/cm$\sp2$, which is one or two orders of magnitude higher than those of conventional systems, and beyond the capacity of high performance air cooling systems. A cooling system which can deal with a high heat flux of up to 4 W/cm$\sp2$ is the one that employs two-phase closed thermosyphons, (i.e., wickless heat pipes) and the present study presents the results of experimental and simulation study on a cooling system using two-phase closed thermosynphons for the cooling of MCM.
dc.format.extent	211 p.
dc.identifier.citation	Source: Masters Abstracts International, Volume: 35-01, page: 0332.
dc.identifier.isbn	9780612115934
dc.identifier.uri	http://hdl.handle.net/10393/9855
dc.identifier.uri	http://dx.doi.org/10.20381/ruor-7997
dc.publisher	University of Ottawa (Canada)
dc.subject.classification	Engineering, Electronics and Electrical.
dc.title	A cooling system using two-phase closed thermosyphon for telecommunication MCM: Experiment and simulation.
dc.type	Thesis

Files

Now showing 1 - 1 of 1