A cooling system using two-phase closed thermosyphon for telecommunication MCM: Experiment and simulation.

Abstract

The present study is concerned with a cooling system for multichip modules (MCM) in telecommunication systems. Due to the higher device operation speed and higher packaging density, the resulting heat flux is known to be 1 to 2 W/cm$\sp2$, which is one or two orders of magnitude higher than those of conventional systems, and beyond the capacity of high performance air cooling systems. A cooling system which can deal with a high heat flux of up to 4 W/cm$\sp2$ is the one that employs two-phase closed thermosyphons, (i.e., wickless heat pipes) and the present study presents the results of experimental and simulation study on a cooling system using two-phase closed thermosynphons for the cooling of MCM.