RF Front-End Design for X Band using 0.15µm GaN HEMT Technology

Abstract

The primary reason for the wireless technology evolution is towards building capacity and obtaining higher data rates. Enclosed locations, densely populated campus, indoor offices, and device-to-device communication will require radios that need to operate at data rates up to 10 Gbps. In the next few years, a new generation of communication systems would emerge to better handle the ever-increasing demand for much wider bandwidth requirements. Simultaneously, key factors such as size, cost, and energy consumption play a distinctive role towards shaping the success of future wireless technologies. In the perspective of 3GPP 5G next generation wireless communication systems, the X band was explicitly targeted with a vast range of applications in point to point radio, point to multi point radio, test equipment, sensors and future wireless communication. An X-band RF front-end circuit for next generation wireless network applications is presented in this work. It details the design of a low noise amplifier and a power amplifier for X band operation. The designed amplifiers were integrated with a wideband single-pole-double-throw switch to achieve an overall front-end structure for 10 GHz. The design was carried out and sent for fabrication using a GaN 0.15µm process provided by NRC, a novel design kit. Due to higher breakdown voltage, high power density, high efficiency, high linearity and better noise performance, GaN HEMTs are a suitable choice for future wireless communication. Thus, the assumption is to further explore capabilities of this process in front-end design for future wireless communications.