Lee, Y.,Rhi, Seok-Ho.2009-03-252009-03-2519961996Source: Masters Abstracts International, Volume: 35-01, page: 0332.9780612115934http://hdl.handle.net/10393/9855http://dx.doi.org/10.20381/ruor-7997The present study is concerned with a cooling system for multichip modules (MCM) in telecommunication systems. Due to the higher device operation speed and higher packaging density, the resulting heat flux is known to be 1 to 2 W/cm$\sp2$, which is one or two orders of magnitude higher than those of conventional systems, and beyond the capacity of high performance air cooling systems. A cooling system which can deal with a high heat flux of up to 4 W/cm$\sp2$ is the one that employs two-phase closed thermosyphons, (i.e., wickless heat pipes) and the present study presents the results of experimental and simulation study on a cooling system using two-phase closed thermosynphons for the cooling of MCM.211 p.Engineering, Electronics and Electrical.Thesis