The multipurpose microelectronic processor.
|Title:||The multipurpose microelectronic processor.|
|Authors:||Samaroo, Winston R.|
|Abstract:||Since the inception of microelectronics only a few years ago, a number of techniques have been devised to solve some of the problems associated with the new concepts. The use of electron and ion-beam machines have led to some of the more important developments and the present trend indicates that these machines will shortly be standard equipment in the fabrication and study of microelectronic circuits. This dissertation describes a microelectronic research facility, which integrates many of the processes required in the fabrication of microelectronic circuits and will, thereby, alleviate some of the basic difficulties arising from the small size of the circuit elements. The machine has been called the "Multipurpose Microelectronic Processor", which was abbreviated to MMP. The design of the MMP and the theory on which it is based have been fully discussed. The MMP was designed primarily for basic research in microelectronics involving thin films but it will also permit the fabrication of microelectronic circuits and will facilitate research in related fields. When completed, the MMP will permit controlled deposition of thin films from an ion beam, electron-beam micromachining, topological inspection using a scanning electron microscope, and chemical analysis using a microanalyser. These processes will be achieved without the need of moving the substrate from one work station to another with the associated problems of reregistration and maintaining clean surfaces. The vacuum system for the MMP has been completed and the scanning electron microscope is in operation. Some modifications to the main electron gun will be necessary to increase the resolution of the scanning electron microscope and to increase the beam power for the machining mode of the MMP. The conditions from which the ideas for the design of the MMP arose are discussed in the Introduction. In Chapter 1, the technology required in the fabrication of thin-film circuits is covered. Special attention is given to those processes, which are closely associated with the MMP. A brief overall description of the MMP is given in Chapter 2. In Chapter 3, two new mechanisms for the bending of ion beams are analysed and a practical design is presented for the ion beam deposition system in the MMP. Chapters 4, 5 and 6 are devoted to the details and performance of the sub-systems in the MMP. A concluding discussion is presented in Chapter 7.|
|Collection||Thèses, 1910 - 2010 // Theses, 1910 - 2010|